JPH0412662U - - Google Patents
Info
- Publication number
- JPH0412662U JPH0412662U JP5343290U JP5343290U JPH0412662U JP H0412662 U JPH0412662 U JP H0412662U JP 5343290 U JP5343290 U JP 5343290U JP 5343290 U JP5343290 U JP 5343290U JP H0412662 U JPH0412662 U JP H0412662U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- lead frame
- semiconductor device
- pilot hole
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
- 238000012850 discrimination method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5343290U JPH0412662U (en]) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5343290U JPH0412662U (en]) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412662U true JPH0412662U (en]) | 1992-01-31 |
Family
ID=31574609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5343290U Pending JPH0412662U (en]) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412662U (en]) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58151048A (ja) * | 1982-03-03 | 1983-09-08 | Toshiba Corp | 半導体装置の製造方法 |
| JPS6167743A (ja) * | 1984-09-07 | 1986-04-07 | Tokuriki Honten Co Ltd | 歯科用金属練成充填材 |
-
1990
- 1990-05-22 JP JP5343290U patent/JPH0412662U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58151048A (ja) * | 1982-03-03 | 1983-09-08 | Toshiba Corp | 半導体装置の製造方法 |
| JPS6167743A (ja) * | 1984-09-07 | 1986-04-07 | Tokuriki Honten Co Ltd | 歯科用金属練成充填材 |
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